Electrostat® Product Range

Raw Chipboard (RC): A key component for Electrostat® composite materials. This specialised chipboard assists a controlled path to ground through material.

High Pressure Laminate (HPL): Electrostat® dissipative High Pressure Laminate has excellent scratch and chemical resistant properties, as well as being easy to clean. Electrostat® HPL is available from stock in postforming grade.

Melamine Faced Chipboard (MFC): Electrostat MFC is the economic alternative to laminate faced chipboard and is ideal for the manufacture of desk carcass components and wall linings. This composite is manufactured using the Electrostat® chipboard and can be colour co-ordinated with Electrostat® laminates for visual harmony.

Laminate Faced Chipboard (LFC): A dissipative composite using Electrostat® raw chipobard and static dissipative HPL to provide a controlled path to ground. This type of composite removes the requirement for a surface mounted grounding stud

Postformed Component (PFC): Postformed laminate composite with factory finished post-formed edge detail. The post-formed top can be specified with one long edge or two long edges.